Updated CMSIS DSP to latest version (CMSIS-SP-00300-r3p2-00rel1.zip)
Build system changes to be able to preprocess assembler sources before compiling them:
- GCC: use gcc '-x assembler-with-cpp'
- ARM: preprocess first, then assemble (two separate commands)
- IAR: added macro definitions and include directories to the assembler command line
Removed CORTEX_ARM_SUPPORT restriction for the DSP libraries.
Tested: LPC1768 with ARM, GCC_ARM and IAR, LPC11U24 with ARM.
If the build system finds a file named mbed_config.h, it will automatically
define a HAVE_MBED_CONFIG_H macro. Various libraries/components can use
this mechanism to provide compile-time configuration for user projects.
build_api.py now support macros defined at compile time, so build.py and
make.py can be used like this:
$ make.py/build.py <options> -DMACRO1 -DMACRO2=VALUE2 ...
Initial support (activate with "-o analyze"). Not working well with IAR
for now (partially because of a bug in goannac++ which was reported to
Red Lizzard).
A new hooks mechanism (hooks.py) allows various targets to customize
part(s) of the build process. This was implemented to allow generation of
custom binary images for the EA LPC4088 target, but it should be generic
enough to allow other such customizations in the future. For now, only the
'binary' step is hooked in toolchains/arm.py.